Coverart for item
The Resource Photonics packaging and integration V : 27 January, 2005, San Jose, California, USA, Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering

Photonics packaging and integration V : 27 January, 2005, San Jose, California, USA, Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering

Label
Photonics packaging and integration V : 27 January, 2005, San Jose, California, USA
Title
Photonics packaging and integration V
Title remainder
27 January, 2005, San Jose, California, USA
Statement of responsibility
Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering
Contributor
Subject
Genre
Language
eng
Member of
Cataloging source
LHL
http://bibfra.me/vocab/lite/collectionName
Optoelectronic interconnects
Illustrations
illustrations
Index
index present
Literary form
non fiction
Nature of contents
bibliography
http://library.link/vocab/relatedWorkOrContributorName
  • Heyler, Randy A
  • Chen, Ray T
  • Society of Photo-optical Instrumentation Engineers
Series statement
Proceedings of SPIE,
Series volume
v. 5731
http://library.link/vocab/subjectName
  • Optoelectronic devices
  • Optical interconnects
  • Microelectronic packaging
  • Photonics
Label
Photonics packaging and integration V : 27 January, 2005, San Jose, California, USA, Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering
Instantiates
Publication
Note
Some earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration
Bibliography note
Includes bibliographical references and index
Dimensions
28 cm.
Extent
v, 136 p.
Isbn
9780819457059
Other physical details
ill.
System control number
  • 2448746-01okla_normanlaw
  • (SIRSI)2448746
  • (Sirsi) o59759687
  • (OCoLC)59759687
Label
Photonics packaging and integration V : 27 January, 2005, San Jose, California, USA, Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering
Publication
Note
Some earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration
Bibliography note
Includes bibliographical references and index
Dimensions
28 cm.
Extent
v, 136 p.
Isbn
9780819457059
Other physical details
ill.
System control number
  • 2448746-01okla_normanlaw
  • (SIRSI)2448746
  • (Sirsi) o59759687
  • (OCoLC)59759687

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