Coverart for item
The Resource Photonics packaging and integration IV : 29 January 2003, San Jose, California, USA, Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering

Photonics packaging and integration IV : 29 January 2003, San Jose, California, USA, Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering

Label
Photonics packaging and integration IV : 29 January 2003, San Jose, California, USA
Title
Photonics packaging and integration IV
Title remainder
29 January 2003, San Jose, California, USA
Statement of responsibility
Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering
Title variation
  • Photonics packaging and integration 4
  • Photonics packaging and integration four
Contributor
Subject
Genre
Language
eng
Member of
Cataloging source
LHL
http://bibfra.me/vocab/lite/collectionName
Optoelectronic interconnects
Illustrations
illustrations
Index
index present
Literary form
non fiction
Nature of contents
bibliography
http://library.link/vocab/relatedWorkOrContributorName
  • Heyler, Randy A
  • Chen, Ray T
  • Society of Photo-optical Instrumentation Engineers
Series statement
SPIE proceedings series,
Series volume
v. 5358
http://library.link/vocab/subjectName
  • Optoelectronic devices
  • Optical interconnects
  • Microelectronic packaging
  • Photonics
Label
Photonics packaging and integration IV : 29 January 2003, San Jose, California, USA, Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering
Instantiates
Publication
Note
  • "SPIE is an international technical society dedicated to advancing engineering and scientific applications of optical, photonic, imaging, electronic, and optoelectronic technologies."
  • Earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration
Bibliography note
Includes bibliographical references and index
Dimensions
28 cm.
Extent
vii, 168 p.
Isbn
9780819452665
Other physical details
ill.
System control number
  • 2267348-01okla_normanlaw
  • (SIRSI)2267348
  • (Sirsi) o55872492
  • (OCoLC)55872492
Label
Photonics packaging and integration IV : 29 January 2003, San Jose, California, USA, Randy A. Heyler, Ray T. Chen, chairs/editors ; sponsored and published by SPIE--the International Society for Optical Engineering
Publication
Note
  • "SPIE is an international technical society dedicated to advancing engineering and scientific applications of optical, photonic, imaging, electronic, and optoelectronic technologies."
  • Earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration
Bibliography note
Includes bibliographical references and index
Dimensions
28 cm.
Extent
vii, 168 p.
Isbn
9780819452665
Other physical details
ill.
System control number
  • 2267348-01okla_normanlaw
  • (SIRSI)2267348
  • (Sirsi) o55872492
  • (OCoLC)55872492

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