The Resource Fundamentals of lead-free solder interconnect technology : from microstructures to reliability, Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma

Fundamentals of lead-free solder interconnect technology : from microstructures to reliability, Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma

Label
Fundamentals of lead-free solder interconnect technology : from microstructures to reliability
Title
Fundamentals of lead-free solder interconnect technology
Title remainder
from microstructures to reliability
Statement of responsibility
Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma
Contributor
Author
Subject
Genre
Language
eng
Summary
This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution. The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based. In summary, this book: Provides an up-to-date overview on lead-free soldering technologies Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique Explores emerging technologies in lead-free soldering
Cataloging source
GW5XE
Dewey number
621.381
Index
index present
LC call number
TK7836
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
http://library.link/vocab/relatedWorkOrContributorName
  • Lee, Tae-Kyu
  • Bieler, Thomas R.
  • Kim, Choong-Un
  • Ma, Hongtao
http://library.link/vocab/subjectName
  • Lead-free electronics manufacturing processes
  • Solder and soldering
  • Lead-free electronics manufacturing processes
  • Solder and soldering
  • Technology & Engineering
  • Technology & Engineering
  • Electronic devices & materials
  • Circuits & components
  • Technology & Engineering
  • Electronics engineering
Label
Fundamentals of lead-free solder interconnect technology : from microstructures to reliability, Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma
Link
https://ezproxy.lib.ou.edu/login?url=http://link.springer.com/10.1007/978-1-4614-9266-5
Instantiates
Publication
Copyright
Antecedent source
unknown
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
  • cr
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
Introduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again
Dimensions
unknown
Extent
1 online resource
File format
unknown
Form of item
online
Isbn
9781461492665
Level of compression
unknown
Media category
computer
Media MARC source
rdamedia
Media type code
  • c
Note
SpringerLink
Other control number
10.1007/978-1-4614-9266-5
Quality assurance targets
not applicable
Reformatting quality
unknown
Sound
unknown sound
Specific material designation
remote
System control number
  • (OCoLC)895189860
  • (OCoLC)ocn895189860
Label
Fundamentals of lead-free solder interconnect technology : from microstructures to reliability, Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma
Link
https://ezproxy.lib.ou.edu/login?url=http://link.springer.com/10.1007/978-1-4614-9266-5
Publication
Copyright
Antecedent source
unknown
Bibliography note
Includes bibliographical references and index
Carrier category
online resource
Carrier category code
  • cr
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type code
  • txt
Content type MARC source
rdacontent
Contents
Introduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again
Dimensions
unknown
Extent
1 online resource
File format
unknown
Form of item
online
Isbn
9781461492665
Level of compression
unknown
Media category
computer
Media MARC source
rdamedia
Media type code
  • c
Note
SpringerLink
Other control number
10.1007/978-1-4614-9266-5
Quality assurance targets
not applicable
Reformatting quality
unknown
Sound
unknown sound
Specific material designation
remote
System control number
  • (OCoLC)895189860
  • (OCoLC)ocn895189860

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