The Resource Electromigration Modeling at Circuit Layout Level, by Cher Ming Tan, Feifei He, (electronic resource)

Electromigration Modeling at Circuit Layout Level, by Cher Ming Tan, Feifei He, (electronic resource)

Label
Electromigration Modeling at Circuit Layout Level
Title
Electromigration Modeling at Circuit Layout Level
Statement of responsibility
by Cher Ming Tan, Feifei He
Creator
Contributor
Author
Author
Subject
Language
  • eng
  • eng
Summary
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.
Member of
Is Subseries of
http://library.link/vocab/creatorName
Tan, Cher Ming
Dewey number
621.3815
http://bibfra.me/vocab/relation/httpidlocgovvocabularyrelatorsaut
  • QVQVOnsBXdE
  • Xbrm0MEVwLQ
Language note
English
LC call number
  • TA169.7
  • T55-T55.3
  • TA403.6
Literary form
non fiction
Nature of contents
dictionaries
http://library.link/vocab/relatedWorkOrContributorName
He, Feifei.
Series statement
SpringerBriefs in Reliability,
http://library.link/vocab/subjectName
  • System safety
  • Quality Control, Reliability, Safety and Risk
  • Electronic Circuits and Devices
  • Atomic, Molecular, Optical and Plasma Physics
Label
Electromigration Modeling at Circuit Layout Level, by Cher Ming Tan, Feifei He, (electronic resource)
Instantiates
Publication
Note
Description based upon print version of record
Bibliography note
Includes bibliographical references
Carrier category
online resource
Carrier category code
cr
Content category
text
Content type code
txt
Contents
Introduction -- 3D Circuit Model Construction and Simulation -- Comparison of EM Performance in Circuit Structure and Test Structure -- Interconnect EM Reliability Modeling at Circuit Layout Level -- Conclusion
Dimensions
unknown
Edition
1st ed. 2013.
Extent
1 online resource (103 p.)
Form of item
online
Isbn
9789814451215
Media category
computer
Media type code
c
Other control number
10.1007/978-981-4451-21-5
Specific material designation
remote
System control number
  • (CKB)2550000001047434
  • (EBL)1206437
  • (SSID)ssj0000878806
  • (PQKBManifestationID)11546183
  • (PQKBTitleCode)TC0000878806
  • (PQKBWorkID)10850709
  • (PQKB)11666501
  • (DE-He213)978-981-4451-21-5
  • (MiAaPQ)EBC1206437
  • (EXLCZ)992550000001047434
Label
Electromigration Modeling at Circuit Layout Level, by Cher Ming Tan, Feifei He, (electronic resource)
Publication
Note
Description based upon print version of record
Bibliography note
Includes bibliographical references
Carrier category
online resource
Carrier category code
cr
Content category
text
Content type code
txt
Contents
Introduction -- 3D Circuit Model Construction and Simulation -- Comparison of EM Performance in Circuit Structure and Test Structure -- Interconnect EM Reliability Modeling at Circuit Layout Level -- Conclusion
Dimensions
unknown
Edition
1st ed. 2013.
Extent
1 online resource (103 p.)
Form of item
online
Isbn
9789814451215
Media category
computer
Media type code
c
Other control number
10.1007/978-981-4451-21-5
Specific material designation
remote
System control number
  • (CKB)2550000001047434
  • (EBL)1206437
  • (SSID)ssj0000878806
  • (PQKBManifestationID)11546183
  • (PQKBTitleCode)TC0000878806
  • (PQKBWorkID)10850709
  • (PQKB)11666501
  • (DE-He213)978-981-4451-21-5
  • (MiAaPQ)EBC1206437
  • (EXLCZ)992550000001047434

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