The Resource Developments in surface contamination and cleaning : cleanliness validation and verification, Volume 7, edited by Rajiv Kohli and K. L. Mittal ; contributors, David E. Albert [and six others]

Developments in surface contamination and cleaning : cleanliness validation and verification, Volume 7, edited by Rajiv Kohli and K. L. Mittal ; contributors, David E. Albert [and six others]

Label
Developments in surface contamination and cleaning : cleanliness validation and verification, Volume 7
Title
Developments in surface contamination and cleaning
Title remainder
cleanliness validation and verification
Title number
Volume 7
Statement of responsibility
edited by Rajiv Kohli and K. L. Mittal ; contributors, David E. Albert [and six others]
Contributor
Contributor
Editor
Subject
Genre
Language
  • eng
  • eng
Summary
As device sizes in the semiconductor industries are shrinking, they become more vulnerable to smaller contaminant particles, and most conventional cleaning techniques employed in the industry are not as effective at smaller scales. The book series Developments in Surface Contamination and Cleaning as a whole provides an excellent source of information on these alternative cleaning techniques as well as methods for characterization and validation of surface contamination. Each volume has a particular topical focus, covering the key techniques and recent developments in the area. The chapters i
Cataloging source
MiAaPQ
Dewey number
  • 620
  • 620.44
Illustrations
illustrations
Index
index present
Language note
English
LC call number
TA418.7
LC item number
.D484 2015
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
http://library.link/vocab/relatedWorkOrContributorName
  • Kohli, Rajiv
  • Mittal, K. L.
  • Albert, David E.
http://library.link/vocab/subjectName
  • Surfaces (Technology)
  • Surface contamination
Label
Developments in surface contamination and cleaning : cleanliness validation and verification, Volume 7, edited by Rajiv Kohli and K. L. Mittal ; contributors, David E. Albert [and six others]
Instantiates
Publication
Copyright
Note
Description based upon print version of record
Bibliography note
Includes bibliographical references at the end of each chapters and index
Carrier category
online resource
Carrier category code
cr
Content category
text
Content type code
txt
Contents
  • Front Cover; Developments in Surface Contamination and Cleaning: Cleanliness Validation and Verification; Copyright; Contents; Contributors; Preface; About the Editors; Chapter 1: Sources and Generation of Surface Contaminants and Their Impact; 1. Introduction; 2. Surface Cleanliness Levels; 3. Sources and Generation of Contaminants; 3.1. Particles; 3.2. Thin Film or Molecular Contamination; 3.3. Ionic Contamination; 3.4. Microbial Contamination; 4. Impact of Contaminants; 4.1. Particle Contamination; 4.1.1. Health Effects; 4.2. Molecular Contamination; 4.3. Ionic Contamination
  • 4.4. Microbial Contamination5. Summary and Conclusions; Acknowledgments; Disclaimer; References; Chapter 2: Mid-IR Spectroscopy as a Tool for Cleanliness Validation; 1. Background; 2. Principles of Grazing-Angle FTIR; 3. Description of the Method; 4. Advantages and Disadvantages; 4.1. Direct, Real-Time Method; 4.2. Detect Anything With An IR Spectrum; 4.3. Automation; 4.4. Access to Small Spaces/Flat Surfaces; 5. Results and Applications; 5.1. Aerospace; 5.2. Manufacturing; 5.3. Pharmaceutical Applications; 5.4. Explosives and Chemical Warfare Agents; 5.5. Tank Trials
  • 5.6. IRRAS by Direct Reflectance6. Future Developments; 7. Summary; References; Chapter 3: Optically Stimulated Electron Emission: A Powerful Tool for Surface Cleanliness Monitoring; 1. Introduction; 2. OSEE Principle; 2.1. Resolution; 2.2. Repeatability and Reproducibility; 2.3. Calibration; 2.4. Factors Affecting OSEE; 2.4.1. Short-Term Factors; 2.4.1.1. Length of Time the Sample Surface is Exposed to UV Light; 2.4.1.2. Distance of the OSEE Sensor from the Surface; 2.4.1.3. Line Voltage; 2.4.1.4. Ambient Temperature; 2.4.1.5. Atmospheric Pressure; 2.4.1.6. Sample Not Properly Grounded
  • 2.4.1.7. Surface Finish2.4.1.8. Air Flow/Turbulence Past the OSEE Sensor; 2.4.1.9. Humidity; 2.4.1.10. Static Charge; 2.4.2. Long-Term Factors; 2.4.2.1. UV Light Intensity; 2.4.2.2. Collector Bias Voltage; 3. Photoemitting Materials; 3.1. Substrate Emitting and Contaminant Nonemitting; 3.2. Substrate Nonemitting and Contaminant Emitting; 3.3. Both Substrate and Contaminant Emitting; 3.4. Both Substrate and Contaminant Nonemitting; 4. Applications of OSEE; 4.1. Surface Cleanliness Monitoring; 4.1.1. Establishing Surface Cleanliness Level
  • 4.1.1.1. Selecting an Appropriate Cleanliness Monitoring Technique4.1.1.2. Establishing Acceptable Level of Cleanliness; 4.1.1.2.1. Empirical Approach; 4.1.1.2.2. Quantitative Approach; 4.1.2. Example Applications of Surface Cleanliness Monitoring; 4.1.2.1. Prebond Surface Quality; 4.1.2.1.1. Application 1; 4.1.2.1.2. Application 2; 4.1.2.1.3. Application 3; 4.1.2.2. Surface Finish; 4.1.2.3. Selecting the ""Right"" Cleaning Process; 4.1.2.4. Optimizing a Cleaning Process; 4.1.2.5. Contamination Detection on Weld Surfaces; 4.1.2.6. Copper Foil Characterization and Cleanliness Testing
  • 4.1.2.7. Inspection for Flux Residue on Electronics Assemblies
Dimensions
unknown
Edition
First edition.
Extent
1 online resource (207 p.)
Form of item
online
Isbn
9780323311458
Media category
computer
Media type code
c
Specific material designation
remote
System control number
  • (CKB)3710000000283083
  • (EBL)1864162
  • (SSID)ssj0001409416
  • (PQKBManifestationID)11908225
  • (PQKBTitleCode)TC0001409416
  • (PQKBWorkID)11359176
  • (PQKB)10195358
  • (MiAaPQ)EBC1864162
  • (EXLCZ)993710000000283083
Label
Developments in surface contamination and cleaning : cleanliness validation and verification, Volume 7, edited by Rajiv Kohli and K. L. Mittal ; contributors, David E. Albert [and six others]
Publication
Copyright
Note
Description based upon print version of record
Bibliography note
Includes bibliographical references at the end of each chapters and index
Carrier category
online resource
Carrier category code
cr
Content category
text
Content type code
txt
Contents
  • Front Cover; Developments in Surface Contamination and Cleaning: Cleanliness Validation and Verification; Copyright; Contents; Contributors; Preface; About the Editors; Chapter 1: Sources and Generation of Surface Contaminants and Their Impact; 1. Introduction; 2. Surface Cleanliness Levels; 3. Sources and Generation of Contaminants; 3.1. Particles; 3.2. Thin Film or Molecular Contamination; 3.3. Ionic Contamination; 3.4. Microbial Contamination; 4. Impact of Contaminants; 4.1. Particle Contamination; 4.1.1. Health Effects; 4.2. Molecular Contamination; 4.3. Ionic Contamination
  • 4.4. Microbial Contamination5. Summary and Conclusions; Acknowledgments; Disclaimer; References; Chapter 2: Mid-IR Spectroscopy as a Tool for Cleanliness Validation; 1. Background; 2. Principles of Grazing-Angle FTIR; 3. Description of the Method; 4. Advantages and Disadvantages; 4.1. Direct, Real-Time Method; 4.2. Detect Anything With An IR Spectrum; 4.3. Automation; 4.4. Access to Small Spaces/Flat Surfaces; 5. Results and Applications; 5.1. Aerospace; 5.2. Manufacturing; 5.3. Pharmaceutical Applications; 5.4. Explosives and Chemical Warfare Agents; 5.5. Tank Trials
  • 5.6. IRRAS by Direct Reflectance6. Future Developments; 7. Summary; References; Chapter 3: Optically Stimulated Electron Emission: A Powerful Tool for Surface Cleanliness Monitoring; 1. Introduction; 2. OSEE Principle; 2.1. Resolution; 2.2. Repeatability and Reproducibility; 2.3. Calibration; 2.4. Factors Affecting OSEE; 2.4.1. Short-Term Factors; 2.4.1.1. Length of Time the Sample Surface is Exposed to UV Light; 2.4.1.2. Distance of the OSEE Sensor from the Surface; 2.4.1.3. Line Voltage; 2.4.1.4. Ambient Temperature; 2.4.1.5. Atmospheric Pressure; 2.4.1.6. Sample Not Properly Grounded
  • 2.4.1.7. Surface Finish2.4.1.8. Air Flow/Turbulence Past the OSEE Sensor; 2.4.1.9. Humidity; 2.4.1.10. Static Charge; 2.4.2. Long-Term Factors; 2.4.2.1. UV Light Intensity; 2.4.2.2. Collector Bias Voltage; 3. Photoemitting Materials; 3.1. Substrate Emitting and Contaminant Nonemitting; 3.2. Substrate Nonemitting and Contaminant Emitting; 3.3. Both Substrate and Contaminant Emitting; 3.4. Both Substrate and Contaminant Nonemitting; 4. Applications of OSEE; 4.1. Surface Cleanliness Monitoring; 4.1.1. Establishing Surface Cleanliness Level
  • 4.1.1.1. Selecting an Appropriate Cleanliness Monitoring Technique4.1.1.2. Establishing Acceptable Level of Cleanliness; 4.1.1.2.1. Empirical Approach; 4.1.1.2.2. Quantitative Approach; 4.1.2. Example Applications of Surface Cleanliness Monitoring; 4.1.2.1. Prebond Surface Quality; 4.1.2.1.1. Application 1; 4.1.2.1.2. Application 2; 4.1.2.1.3. Application 3; 4.1.2.2. Surface Finish; 4.1.2.3. Selecting the ""Right"" Cleaning Process; 4.1.2.4. Optimizing a Cleaning Process; 4.1.2.5. Contamination Detection on Weld Surfaces; 4.1.2.6. Copper Foil Characterization and Cleanliness Testing
  • 4.1.2.7. Inspection for Flux Residue on Electronics Assemblies
Dimensions
unknown
Edition
First edition.
Extent
1 online resource (207 p.)
Form of item
online
Isbn
9780323311458
Media category
computer
Media type code
c
Specific material designation
remote
System control number
  • (CKB)3710000000283083
  • (EBL)1864162
  • (SSID)ssj0001409416
  • (PQKBManifestationID)11908225
  • (PQKBTitleCode)TC0001409416
  • (PQKBWorkID)11359176
  • (PQKB)10195358
  • (MiAaPQ)EBC1864162
  • (EXLCZ)993710000000283083

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